The Israeli company expects its expanded capacity to produce enough ingredient to replace approximately 1,400 tonnes of eggs in 2027, equivalent to around 82,000 eggs a day. The ingredient is designed to replicate the texturising functions of eggs and hydrocolloids across a range of food applications.
Meala said its proteins are already being used in commercially available products, with manufacturers adopting the ingredient to reduce reliance on eggs and conventional texture additives. Applications include bakery products and plant-based meat alternatives.
The ingredient is marketed through industry partners, including dsm-firmenich, which supplies Vertis™ PB Pea for savoury applications, and Lasenor Emul, which offers LASENOR VP-100 as an egg replacement for bakery products. It can be listed simply as pea protein on product labels.
The multifunctional protein can replace several ingredients within a formulation, helping manufacturers simplify recipes while maintaining texture and sensory characteristics
Cost reduction is another driver for adoption. In an assessed sponge cake formulation, Meala reported a potential reduction in formulation costs of more than 40% compared with an egg-based alternative. The company also highlighted reduced requirements for refrigerated storage and transport associated with liquid eggs.
Meala said its multifunctional protein can replace several ingredients within a formulation, helping manufacturers simplify recipes while maintaining texture and sensory characteristics.
A life cycle assessment conducted by Van Hall Larenstein University of Applied Sciences in the Netherlands found that the pea protein had a 63% lower carbon footprint and a 96% lower water footprint per kilogram of protein compared with egg powder.
“Manufacturers seek ingredients that deliver [a good eating experience] alongside reliable performance, competitive costs and a stable supply chain,” said Hadar Ekhoiz-Razmovich, chief executive officer and co-founder of Meala.
The company will showcase its ingredients at Fi Europe in Frankfurt from 17–19 November, at stand 51SU53.
